JPH0455364B2 - - Google Patents
Info
- Publication number
- JPH0455364B2 JPH0455364B2 JP11542485A JP11542485A JPH0455364B2 JP H0455364 B2 JPH0455364 B2 JP H0455364B2 JP 11542485 A JP11542485 A JP 11542485A JP 11542485 A JP11542485 A JP 11542485A JP H0455364 B2 JPH0455364 B2 JP H0455364B2
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- resin
- alumina
- thermosetting resin
- nonwoven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 239000000835 fiber Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000004745 nonwoven fabric Substances 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11542485A JPS61273948A (ja) | 1985-05-30 | 1985-05-30 | 熱硬化性樹脂積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11542485A JPS61273948A (ja) | 1985-05-30 | 1985-05-30 | 熱硬化性樹脂積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61273948A JPS61273948A (ja) | 1986-12-04 |
| JPH0455364B2 true JPH0455364B2 (en]) | 1992-09-03 |
Family
ID=14662225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11542485A Granted JPS61273948A (ja) | 1985-05-30 | 1985-05-30 | 熱硬化性樹脂積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61273948A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8722191B2 (en) | 2006-03-03 | 2014-05-13 | Sumitomo Bakelite Co., Ltd. | Intermediate layer material and composite laminate |
| JP7428984B2 (ja) * | 2019-09-17 | 2024-02-07 | 株式会社巴川コーポレーション | 断熱材およびその製造方法 |
-
1985
- 1985-05-30 JP JP11542485A patent/JPS61273948A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61273948A (ja) | 1986-12-04 |
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